We provide interconnections between the PICs and the external world
The Advanced Packaging area provides integration services to interconnect PICs to the external world:
- Input/output optical coupling
- Low-speed and high speed electrical interconnections
- Thermal management
- Hermetic packaging
We help our customers during all development phases
We provide fabrication services to help our customers during all development phases, from R&D to pre-production. We serve customers operating in several application fields: optical communications, quantum communications, space applications, and advanced sensors.
For more information, visit the facility’s website
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